Disilane (Si2H6)
Si2H6 is used for rapid low temperature deposition to form uniformed film in the miniaturized semiconductor process.
SPECIFICATION
Unit : ppmvSi2H6 | O2+Ar | N2 | CO2 | CH4 | SiH4 | Si3H8 | Si4H10 | Chlorosilane | Siloxane | H20 |
---|---|---|---|---|---|---|---|---|---|---|
99.99% [Excluded SiH4, Si3H8, Si4H10] |
1.0 | 2.0 | 1.0 | 1.0 | 500 | 50 | 50 | 0.2 | 3.0 | 1.0 |
Si2H6 | 99.99% [Excluded SiH4, Si3H8, Si4H10] |
|
---|---|---|
O2+Ar | 1.0 | |
N2 | 2.0 | |
CO2 | 1.0 | |
CH4 | 1.0 | |
SiH4 | 500 | |
Si3H8 | 50 | |
Si4H10 | 50 | |
Chlorosilane | 0.2 | |
Siloxane | 3.0 | |
H2O | 1.0 |
CYLINDERS INFORMATION
TYPE | MATERIAL | FILLING WEIGHT | VALVE CONNECTION TYPE |
---|---|---|---|
47L | Cr-Mo Steel, Mn Steel | 3 / 10 / 12 kg | JIS-22-14L, CGA/DISS 632 etc. |
TYPE | 47L |
---|---|
MATERIAL | Cr-Mo Steel, Mn Steel |
FILLING WEIGHT | 3 / 10 / 12 kg |
VALVE CONNECTION TYPE | JIS-22-14L, CGA/DISS 632 etc. |